2012.3

Born Semiconductor (Shenzhen) Co., Ltd. was established.

2012.3

Born Semiconductor (Shenzhen) Co., Ltd. was established.

Born Semiconductor (Shenzhen) Co., Ltd. was established.

2016.6

Establish a R&D center in Xi’an

2016.6

Establish a R&D center in Xi’an

Establish a Xi’an R&D Center

2018.6

Tianjin factory goes into production.

2018.6

Tianjin factory goes into production.

Tianjin factory goes into production.

2020.11

Established a subsidiary, Born Semiconductor (Henan) Co., Ltd.

2020.11

Established a subsidiary, Born Semiconductor (Henan) Co., Ltd.

Established a subsidiary, Born Semiconductor (Henan) Co., Ltd.

2021.5

The packaging line at the Henan production base has been put into operation.

2021.5

The packaging line at the Henan production base has been put into operation.

The packaging line at the Henan production base has been put into operation.

2021.11

Established the IC design company, Born Semiconductor (Wuxi) Co., Ltd.

2021.11

Established the IC design company, Born Semiconductor (Wuxi) Co., Ltd.

Established the IC design company, Born Semiconductor (Wuxi) Co., Ltd.

2022.5

Construction of the 5-inch wafer fab has been completed.

2022.5

Construction of the 5-inch wafer fab has been completed.

Construction of the 5-inch wafer fab has been completed.

2024.12

Construction of the Hubei Bern Semiconductor Industrial Park

2024.12

Construction of the Hubei Bern Semiconductor Industrial Park

Construction of the Hubei Bern Semiconductor Industrial Park

2012.3


2016.6


2018.6


2020.11


2021.5


2021.11


2022.5


2024.12