The exhibition is closing, thank you for having you! Born Semiconductor will meet you again next year

On the afternoon of July 10th, the three-day Munich Shanghai Electronics Show came to an end at the Shanghai New International Expo Center. This exhibition brings together thousands of companies, and the various series of products launched by Born Semiconductor not only enrich the existing industry chain, but also greatly enhance the overall competitiveness of the products.

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2024-07

The official website of Born Semiconductor has been upgraded and launched!

New look, new journey, the official website of Born Semiconductor (Shenzhen) Co., Ltd. has been upgraded and launched!

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2024-06

Born invites you to attend the 2024 Munich Shanghai Electronics Show

On July 8-10, 2024, a new edition of the Munich Shanghai Electronics Show will be held. Here, we will be filled with enthusiasm and look forward to your arrival!

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2024-06

What are the development advantages of the domestic circuit protection component industry?

The development advantages of the domestic circuit protection component industry include: 1. The strong demand in downstream markets and the upgrading of electronic products have driven the growth of the circuit protection industry. 2. Industry manufacturers with high technological content and leading technology can achieve high profit margins and maintain continuous investment in research and development and equipment. 3. The production areas are concentrated in China, which has become the world's production base for electronic products and driven the rapid growth of the industry. 4. Supported by national industrial policies, circuit protection components are a new type of electronic component and an industry encouraged by the country for development.

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2024-06

Investing 5 billion euros, STMicroelectronics announces the construction of an 8-inch SiC wafer fab in Italy

STMicroelectronics announced that it will invest 5 billion euros to establish a 200mm (8-inch) silicon carbide (SiC) manufacturing plant in Catania, Italy, for the production of SiC power devices and modules. This SiC park will integrate all steps from substrate development to wafer manufacturing, module assembly, and packaging, with the aim of improving yield and performance. This project is the center of STMicroelectronics' global silicon carbide ecosystem and the first factory in Europe to achieve mass production of 200nm silicon carbide wafers. The Italian government will provide approximately 2 billion euros in support within the framework of the European Chip Act, and the factory is planned to start mass production in 2026 and is expected to reach full capacity by 2033.

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2024-06

ASML confirms delivery of high NA EUV lithography machines worth $380 million to TSMC this year

ASML has confirmed that it will deliver a high NA EUV lithography machine worth $380 million to TSMC, which had previously stated that it did not require this technology. TSMC has changed its mindset and plans to produce chips with higher precision. ASML's High NA lithography machine is expected to reduce the size by 66% and increase the upper limit of chip manufacturing. TSMC plans to use GAAFET transistors at the 2nm node.

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2024-06

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