Zero breakthrough in domestic equipment! Domestic pre coating and developing equipment will enter the OCF international supply chain for the first time!

Domestic pre coating and developing equipment will enter the OCF international supply chain for the first time, which is a major breakthrough for domestic equipment. Xinda Semiconductor Equipment (Suzhou) Co., Ltd. has cooperated with Jilin Qiushi Spectral Data Technology Co., Ltd. to achieve complete localization of coating and developing equipment, which can replace imported foreign products. Xinda Semiconductor plans to complete the research and development, production, testing, and sales of 14-28nm equipment within the next three years, with a total R&D investment expected to exceed 100 million yuan within five years. The research and production of this equipment have laid a solid foundation for breakthroughs in domestic photolithography processes, especially for further breakthroughs in photoresist.

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2024-06

Mitsubishi Electric Kumamoto SiC wafer fab to be put into operation 5 months ahead of schedule

Mitsubishi Electric will build a new 8-inch SiC wafer fab in Kumamoto, Japan to operate ahead of schedule in response to market demand growth. Applied in the automotive and industrial fields, it is expected to improve the driving range and overall energy-saving effect of electric vehicles. Mitsubishi Electric plans to expand the sales proportion of SiC and strengthen related production facilities.

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2024-06

Beijing Integrated Circuit Industry Education Integration Base will be put into operation in September next year

The Beijing Integrated Circuit Industry Education Integration Base project is currently under construction and is expected to be put into use in September 2025. This base is located in the core area of Beijing Economic Development Zone, with a total construction area of 105524 square meters. It will include four teaching and research buildings with 11 floors above ground and 3 floors underground. The project aims to provide a venue that integrates teaching, research, and living functions, with a maximum capacity of 2000 people for simultaneous on campus training. The building adopts a series of intelligent and green construction technologies, including BIM 3D intelligent steel structure modeling, intelligent building robots, digital twin visualization delivery and operation systems, etc., to improve construction level and safety production. The construction of this base is an important measure to deepen the integration of industry and education and cultivate integrated circuit talents. The construction unit will ensure the progress and quality of the project and turn it into a high-quality project.

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2024-06

Saudi Arabia establishes National Semiconductor Center, creating 'Silicon Valley of the Middle East'

To reduce dependence on oil exports, Saudi Arabia has established a national semiconductor center and created the "Silicon Valley of the Middle East".

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2024-06

Development of third-generation semiconductor materials in various countries around the world

The third-generation semiconductor materials, represented by silicon carbide (SiC), gallium nitride (GaN), zinc oxide (ZnO), diamond, aluminum nitride (AlN), etc., have wider bandgap width, higher breakdown electric field, higher thermal conductivity, higher electron saturation rate, and higher radiation resistance. These materials are mainly used in fields such as optoelectronic devices and power electronic devices, and have enormous market potential. Developed countries and regions such as Europe, America, and Japan have included silicon carbide semiconductor technology in their national strategies and invested heavily in supporting its development.

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2024-06

PPTC advantages of overcurrent protection devices

PPTC has a wide range of applications in circuits, with advantages such as easy installation, reusability, and good performance.

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2024-06

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