PACKAGING OEM

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Packaging foundry

Package Model

Maximum chip size

Reference Drawings

DO-218AB

216-240mil,The upper limit of thickness is 320 μ m

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Bourne Semiconductor (Shenzhen) Co., Ltd.

BORN SEMICONDUCTOR(SHENZHEN)CO.,LTD

7/F and 13/F, Senheinokochuang Building, Gaoke Industrial Zone, Dezheng Road, Shiyan Street, Bao 'an District, Shenzhen

0755-23049906

Factory Address: Building 6, Intelligent Hardware Industry Port, Intersection of Zheng Bei Avenue and Tan Huai Avenue, Muluan Street, Wuzhi County, Jiaozuo City, Henan Province

cling@born-tw.com

300.cn

Shenzhen

SEO

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