PACKAGING OEM

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Packaging foundry

Package Model

Maximum chip size

Reference Drawings

SMC200(110mil)

110-114mil，The upper limit of thickness is 300 μ m

SMC200(100mil)

50-70mil/78-94mil，The upper limit of thickness is 300 μ m

SMC200(160mil)

158-162mil，The upper limit of thickness is 30 μ m

SMC(180mil）

178-181mil，The upper limit of thickness is 300 μ m

SMB(100mil)

94-114mil，The upper limit of thickness is 300 μ m

SMB

32-49mil/50-84mil，The upper limit of thickness is 300 μ m

SMA

28-46mil/50-70mil，The upper limit of thickness is 300 μ m

DO-218AB

216-240mil,The upper limit of thickness is 320 μ m

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Bourne Semiconductor (Shenzhen) Co., Ltd.

BORN SEMICONDUCTOR(SHENZHEN)CO.,LTD

7/F and 13/F, Senheinokochuang Building, Gaoke Industrial Zone, Dezheng Road, Shiyan Street, Bao 'an District, Shenzhen

0755-23049906

Factory Address: Building 6, Intelligent Hardware Industry Port, Intersection of Zheng Bei Avenue and Tan Huai Avenue, Muluan Street, Wuzhi County, Jiaozuo City, Henan Province

cling@born-tw.com

300.cn

Shenzhen

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